Senior Research Engineer II, fan-in/fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME

Job Description Senior Research Engineer, Advanced Packaging IME's Advanced Packaging Programme is looking for a passionate Engineer to drive prototyping and small-volume manufacturing activities using state-of-the-art packaging platforms such as fan-in/fan-out wafer-level packaging, 2.5D interposers, and W2W/C2W 3D integration. The successful candidate will play a key role in developing innovative package architectures, advancing technology demonstrations, and working closely with researchers and industry collaborators to translate concepts into functional prototypes. The role focuses on delivering high-quality products, ensuring process stability, coordinating manufacturing operations. Job Responsibilities - Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies, including Fan-In/Fan-Out Wafer Level Packaging (FOWLP), 2.5D interposers, and W2W/C2W 3D integration. - Develop manufacturing plans, process flows, and work instructions to meet customer and project requirements. - Monitor production activities, troubleshoot process issues, and implement corrective actions to improve yield, quality, and cycle time. - Work closely with process, equipment, and quality engineers to ensure stable and repeatable manufacturing performance. - Coordinate wafer and material logistics, production scheduling, and resource allocation to ensure on-time delivery. - Perform process monitoring, yield analysis, failure analysis, and root-cause investigations. - Support customer prototype builds, engineering lots, and qualification activities. - Drive continuous improvement initiatives to enhance manufacturing efficiency, quality, and operational excellence. - Maintain manufacturing documentation, including process specifications, manufacturing reports, and quality records. - Ensure compliance with safety, quality, and operational procedures Job Requirement - Bachelor's, master’s degree in electrical engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related discipline. - 5-10 years of experience in semiconductor manufacturing, advanced packaging, process integration, or related fields. - Knowledge of semiconductor packaging processes such as lithography, plating, RDL formation, wafer thinning, bonding, molding, and assembly is advantageous. - Hands-on experience in prototype builds or low-volume manufacturing environments. - Knowledge of 2.5D/3D IC integration, hybrid bonding, chiplet packaging, or heterogeneous integration technologies. - Experience with manufacturing execution systems (MES), quality management systems, and process qualification methodologies. - Familiarity with statistical process control (SPC), yield analysis, and problem-solving methodologies. - Strong analytical, troubleshooting, and data analysis skills. - Ability to work effectively in a multidisciplinary team environment and interact with internal and external stakeholders. - Excellent communication and project coordination skills.

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