New Product Introduction Engineer

Position Summary The NPI Engineer will be responsible for supporting new product introduction (NPI) activities and ensuring smooth transition from development to high-volume manufacturing. This role will work closely with cross-functional teams to establish, qualify, and optimize manufacturing processes across semiconductor operations including lithography, wet processes, die preparation, pick-and-place (PnP), reconstitution (recon), molding, and other backend processes. Responsibilities New Product Introduction (NPI) - Lead and support NPI builds from prototype through engineering and qualification stages to mass production. - Drive process setup, line readiness, and material qualification for new products. - Collaborate with R&D, Product Engineering, and Quality teams to ensure manufacturability and process robustness. - Develop and review process flow, work instructions, FMEA, and control plans for new products. - Coordinate engineering builds, monitor progress, and resolve technical issues during NPI phases. - Support customer requirements, audits, and documentation for product qualification. Process Engineering & Operations Support - Provide technical support for assigned backend processes - Troubleshoot process excursions, yield issues, and equipment-related problems. - Analyze process data, SPC trends, and implement corrective and preventive actions (CAPA). - Drive continuous improvement initiatives to enhance yield, quality, and cycle time. - Support production in achieving output, quality, and cost targets. - Work closely with Equipment, Quality, Production, and Supply Chain teams to ensure seamless operations. - Interface with suppliers and vendors for material and equipment-related qualifications. - Participate in design reviews and provide DFM (Design for Manufacturability) feedback. - Maintain accurate documentation for process specifications, changes, and qualifications. - Ensure compliance with internal standards, customer requirements, and industry regulations. - Support audits (internal, customer, and certification audits). Requirements - Bachelor’s Degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related field. - At least 5 years of experience in semiconductor manufacturing, preferably in backend/advanced packaging. - Experience in NPI, process development, or high-mix manufacturing environment is an advantage. - Familiarity with semiconductor processes such as lithography, wet, die prep, PnP, recon, and molding. - Strong problem-solving skills with knowledge of root cause analysis tools (e.g., 8D, Fishbone, FMEA). - Experience with SPC, DOE, and data analysis tools is preferred. - Good communication and stakeholder management skills. - Ability to work in a fast-paced, high-volume manufacturing environment. - Knowledge of advanced packaging technologies (e.g., fan-out, wafer-level packaging). - Hands-on experience with automation and MES systems. - Six Sigma / Lean certification is a plus.

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